StepwisePadDriverInDeep-submicronTechnology
Stepwise pad driver in deep-submicron technology
This project concerns a low-power pad driver design invented by the supervisor approximately 15 years ago [1]. Using stepwise charging [2], the driver consumed considerably less power than the fCV2 which is usually considered the lower limit for rail-to-rail swing.
The driver was implemented in a 0.8um CMOS process and reached decent performance for the time with a transition time of about 10ns. With present semiconductor processes, we should be able to do quite a bit better while still dissipating less than fCV2. With these higher switching speeds, it will however be necessary to consider the package effects (bond-wire inductances and the like). Therein lies the novel aspects of this project.
Successful completion of the project requires good CMOS layout and circuit simulation skills (i.e. Spice/Spectre). Good results may be publishable.
Supervisor
Lars Svensson
Tentative and rough time plan
- Week 1-3
- Literature study, CAD tool setup, Development of detailed time plan
- Week 4-9
- Schematic-level design, Simulation, Verification of dissipation properties
- Week 10-16
- Layout and verification vs. schematic
- Week 17-20
- Buffer time, report writing
References
[1] L.”J.” Svensson, W.C. Athas, and R.S-C.Wen. A sub-CV2 pad driver with 10 ns transition time. In Proc. of the International Symposium on Low-Power Electronics and Design, Monterey, CA, Aug 12–14, 1996.
[2] L.”J.” Svensson and J.G. Koller. Driving a capacitive load without dissipating fCV2. 1994 Symposium on Low Power Electronics, Oct. 1994.