Nanofabrication procedures

Dicing

When dicing a large substrate into smaller pieces do not cut all the way through but save about 0.2 mm. In this way it is possible to fabricate at many sensor surfaces at the same time.

• Dimensions of samples
  • Xnano (9x9 mm)
  • EC-LSPR (14.5x14.5 mm)

Cleaning of substrates

Colloidal lithography

• Adsorption of PS colloids
• Metal deposition
• Tape strip

Hole-mask colloidal lithography

• Spin-coating
• Adsorption of PS colloids
• 1st metal deposition
• Tape strip
• O2-plasma etch
• 2nd metal deposition
• Lift-off

Thin film deposition

• Spacer layer
• Nanoparticle films
• Alloy thin films

Annealing

• Furnace
• Annealing reactor

Samples fabricated by:

• Standard
• Niklas
• Rickard
• …